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IPC 3408

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General Requirements for Anisotropically Conductive Adhesives Films
Association Connecting Electronics Industries / 01-Nov-1996 / 32 pages

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.



Product Code(s): 3408(D)1



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