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IPC 4101D

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Model: IPC 4101D

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Specification for Base Materials for Rigid and Multilayer Printed Boards

STANDARD by Association Connecting Electronics Industries, 04/01/2014.

LANGUAGES: English

HISTORICAL EDITIONS: IPC 4101C, IPC 4101B, IPC 4101A, IPC 4101, IPC L-108B


Product Details

Published: 04/01/2014
Number of Pages:168
File Size: 1 file


Full Description

This specification covers the requirements for base materials that are referred to as laminate or prepreg. These

are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This

document contains 64 individual specification sheets that can be searched using keywords. These keywords allow the

document's user to find materials of a similar nature, but with specific differing properties that fine-tune their

laminate and/or prepreg selection needs. The D revision includes six new specification sheets which reflect the

expanded offerings for current commercially available laminates and prepregs with improved or additional

properties that are one or more of the following: low-halogen content, high-thermal performance, high speed/high

frequency performance or thermally conductivity. Additionally, to keep this revision D current with the global

industry, eight specification sheets in the prior revision were removed as they are no longer utilized nor

manufactured.


Document History

IPC 4101D
April 2014
Specification for Base Materials for Rigid and Multilayer Printed Boards
MOST RECENT

IPC 4101C
August 2009
Specification for Base Materials for Rigid and Multilayer Printed Boards
HISTORICAL VERSION

IPC 4101B
June 2006
Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
HISTORICAL VERSION

IPC 4101A
June 2002
Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
HISTORICAL VERSION

IPC 4101
December 1997
Specifications for Base Materials for Rigid and Multilayer Printed Boards
HISTORICAL VERSION

IPC L-108B
June 1990
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
HISTORICAL VERSION

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