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IPC A-610F

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Model: IPC A-610F

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Acceptability of Electronic Assemblies

STANDARD by Association Connecting Electronics Industries, 07/01/2014.


Product Details

Edition:F
Published: 07/01/2014
Number of Pages:440
File Size: 1 file , 17 MB


Full Description

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding - all without eleminating any requirements.

Major topics include:
flex attachment,
board-in-board,
part-on-part,
both lead-free and tin-lead criteria,
component orientation and soldering criteria for through hole,
SMT,
cleaning, marking, coating and laminate requirements.
IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria - 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001.


Document History

IPC A-610F
July 2014
Acceptability of Electronic Assemblies
MOST RECENT

IPC A-610E
April 2010
Acceptability of Electronic Assemblies
HISTORICAL VERSION

IPC A-610D
February 2005
Acceptability of Electronic Assemblies
HISTORICAL VERSION

IPC A-610C
January 2000
Acceptability of Electronic Assemblies
HISTORICAL VERSION

IPC A-610B AMENDMENT 1
April 1996
Acceptability of Printed Board Assemblies
HISTORICAL VERSION

IPC A-610B
December 1994
Acceptability of Printed Board Assemblies - Incorporates Amendment 1
HISTORICAL VERSION

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